Additive Manufacturing Simulations - Print to Perform

Track: Product Definition

Session Number: 1126
Date: Mon, Feb 25th, 2019
Time: 1:55 PM - 2:45 PM

Description:

While Additive Manufacturing (AM) has opened up possibilities for product design that were not even contemplated before, the industry still struggles with unknowns: part distortions, residual stress, and microstructure defects. The 3DEXPERIENCE Platform provides a digital thread from design to simulation to production. Within this framework, engineers can perform detailed thermo mechanical analyses to predict complex physics, such as microstructure, as-built material properties, and buckling. A faster eigenstrain-based simulation method is also available to obtain distortions for part compensation iterations. These simulation tools were awarded first place in residual stress prediction by the recent NIST AM Benchmark, and have been validated for a range of process types and materials.
Sub-Categorization: Product Design (PD)
Session Type: Process Session (Customer or Partner-delivered)

Conference Hot Topics: Additive Manufacturing
Industry: Academic, Aerospace & Defense, Architecture, Engineering & Construction, Consumer Goods & Retail, Consumer Packaged Goods & Retail, Energy, Process and Utilities, Financial & Business Services, High-Tech, Industrial Equipment, Life Sciences, Marine & Offshore, Natural Resources, Transportation & Mobility
Applicable Products: 3DEXPERIENCE, CATIA
What will attendees get out of this presentation?: TBD
Sub-Categorization: Product Design (PD)
Session Type: Process Session (Customer or Partner-delivered)

Conference Hot Topics: Additive Manufacturing
Industry: Academic, Aerospace & Defense, Architecture, Engineering & Construction, Consumer Goods & Retail, Consumer Packaged Goods & Retail, Energy, Process and Utilities, Financial & Business Services, High-Tech, Industrial Equipment, Life Sciences, Marine & Offshore, Natural Resources, Transportation & Mobility
Applicable Products: 3DEXPERIENCE, CATIA
What will attendees get out of this presentation?: TBD